US Patent Issued to NANYA TECHNOLOGY on July 14 for "Semiconductor wafer" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,073, issued on July 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan).

"Semiconductor wafer" was invented by Wei Zhong Li (New Taipei City, Taiwan) and Hsih-Yang Chiu (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor wafer includes a scribe line and a probe pad. The scribe line extends along a first direction. The probe pad is disposed on the scribe line and is configured to contact a probe needle. The probe pad includes a first metal layer, a dielectric layer, and a second metal layer. The dielectric layer is disposed on the first metal layer, in which the dielectric layer includes a first re...