US Patent Issued to NANYA TECHNOLOGY on July 14 for "Interconnection structure and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,139, issued on July 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Interconnection structure and method for manufacturing the same" was invented by Zih-Hong Yang (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnection structure and a method of manufacturing an interconnection structure are provided. The interconnection structure includes a first dielectric layer, a second dielectric layer disposed on the first dielectric layer, and a first conductive layer disposed in the first dielectric layer. The interconnection structure also includes a conductive via electrically connected with the first conducti...