US Patent Issued to NANYA TECHNOLOGY on Aug. 25 for "Package structure and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,198, issued on Aug. 25, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan).

"Package structure and method for manufacturing the same" was invented by Wu-Der Yang (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure and a method of manufacturing a package structure are provided. The package structure includes a first substrate, a first electronic component, a second substrate and a second electronic component. The first electronic component is disposed over a first through hole of the first substrate. The first electronic component is electrically connected to a first patterned circuit layer of the fi...