ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,710,467, issued on Aug. 18, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan).

"Wafer tester and wafer testing method and system" was invented by Ching-Chung Wang (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a wafer testing method, including: assigning multiple testing programs to multiple wafers, wherein each of the testing programs includes testing algorithms configured to measure parameters of the wafers; setting multiple sets of testing conditions for the testing programs; and testing at least one of the wafers by executing a corresponding one of the testing programs according...