US Patent Issued to NANTONG TONGFU MICROELECTRONICS, TONGFU MICROELECTRONICS on Feb. 24 for "Packaging structure having semiconductor chips and encapsulation layers and formation method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,083, issued on Feb. 24, was assigned to NANTONG TONGFU MICROELECTRONICS Co. LTD (Nantong, China) and TONGFU MICROELECTRONICS Co. LTD. (Nantong, China).

"Packaging structure having semiconductor chips and encapsulation layers and formation method thereof" was invented by Lei Shi (Nantong, China), Yujuan Tao (Nantong, China) and Ying Dai (Nantong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging structure and a formation method thereof are provided. The packaging structure includes a carrier board, and a plurality of semiconductor chips adhered to the carrier board. Each semiconductor chip has a functional surface and a non-functional ...