US Patent Issued to Nano and Advanced Materials Institute on April 21 for "High dispensing rate, high thermal conductivity silicone thermal gel with vertical stability and no cracking" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,706, issued on April 21, was assigned to Nano and Advanced Materials Institute Ltd. (Hong Kong, Hong Kong).

"High dispensing rate, high thermal conductivity silicone thermal gel with vertical stability and no cracking" was invented by Xiaohua Chen (Hong Kong, Hong Kong), Jinliang Zhao (Hong Kong, Hong Kong) and Chi Ho Kwok (Hong Kong, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a single-part thermal polysiloxane gel which demonstrates remarkable vertical stability, thermal conductivity, and rapid dispensing rate. The present invention is characterized by its polysiloxane polymer network formed by reacti...