US Patent Issued to NANJING UNIVERSITY on June 23 for "Method for recycling silver from waste IC chips using soluble starch" (Chinese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,662,717, issued on June 23, was assigned to NANJING UNIVERSITY (Nanjing, China).

"Method for recycling silver from waste IC chips using soluble starch" was invented by Zhan Qu (Nanjing, China), Xianze Wang (Nanjing, China), Hongqiang Ren (Nanjing, China), Jinfeng Wang (Nanjing, China), Junzhen Liu (Nanjing, China) and Yusen Chen (Nanjing, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for recycling silver from a waste IC chip include: heating to disassemble an IC chip, and crushing the IC chip into powders; adding the powders to a nitric acid solution, heating, centrifuging and collecting a first filtrate; adding soluble starch to the fir...