US Patent Issued to NAN YA PLASTICS on June 30 for "Pressure-sensitive adhesive tape suitable for component cutting process" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,723, issued on June 30, was assigned to NAN YA PLASTICS Corp. (Taipei, Taiwan).

"Pressure-sensitive adhesive tape suitable for component cutting process" was invented by Te-Chao Liao (Taipei, Taiwan), Chun-Che Tsao (Taipei, Taiwan) and Cheng-Hung Chen (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pressure-sensitive adhesive tape suitable for component cutting process is provided. The pressure-sensitive adhesive tape includes a release film layer, an adhesive layer, and a support base layer that are stacked in sequence. Based on the adhesive layer having a total weight percent of 100 wt %, the adhesive layer includes 40-50 wt % of ...