ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,365, issued on April 7, was assigned to NAN YA PLASTICS Corp. (Taipei, Taiwan).
"Resin composition" was invented by Te-Chao Liao (Taipei, Taiwan), Hung-Yi Chang (Taipei, Taiwan), Chia-Lin Liu (Taipei, Taiwan) and Wei-Ru Huang (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition is provided. The resin composition includes a resin and an inorganic filler. The resin includes a bismaleimide resin and a polyphenylene ether resin. The inorganic filler includes a first inorganic filler and a second inorganic filler. An average particle size of the first inorganic filler is 0.3 micro metre to 0.6 micro metre. An average particl...