US Patent Issued to NAMICS on May 19 for "Liquid compression molding material" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,668, issued on May 19, was assigned to NAMICS Corp. (Niigata, Japan).

"Liquid compression molding material" was invented by Makoto Suzuki (Niigata, Japan), Tsuyoshi Kamimura (Niigata, Japan) and Yosuke Sakai (Niigata, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for producing a semiconductor element by wafer-level chip-size packaging includes applying a liquid compression molding material to a wafer after completion of circuit formation and subjecting the wafer to sealing treatment by compression molding. The liquid compression molding material includes (A) an epoxy resin; (B) a curing agent; and (C) a filler. The liquid compression ...