ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,416, issued on April 14, was assigned to NAMICS Corp. (Niigata, Japan).
"Laminate for wiring board" was invented by Naoki Obata (Niigata, Japan) and Makiko Sato (Niigata, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention is directed to provide novel laminates for wiring boards. Novel laminates for wiring boards according to the present invention includes an insulating substrate layer and copper wiring, the laminate having a circuit linearity of 1.0 or more and 1.7 or less."
The patent was filed on June 10, 2021, under Application No. 18/283,537.
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