US Patent Issued to NAKATA MANUFACTURING on June 23 for "Squeeze device" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,701, issued on June 23, was assigned to NAKATA MANUFACTURING Co. LTD. (Osaka, Japan).

"Squeeze device" was invented by Masato Nishii (Osaka, Japan), Hiromasa Kitayama (Osaka, Japan), Tomoyasu Nakano (Osaka, Japan) and Feizhou Wang (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A squeeze device for electric resistance welded pipe manufacturing is provided. In the squeeze device, a roll support plate is inserted in a manner allowing taking off of the roll support plate into a U-shaped fixed stand with an open top through the open top. The roll support plate supports right and left side rolls in a pair and an upper roll on an upstream-sid...