US Patent Issued to MURATA MANUFACTURING on Sept. 15 for "Multilayer dielectric substrate and method for manufacturing multilayer dielectric substrate" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,968, issued on Sept. 15, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).

"Multilayer dielectric substrate and method for manufacturing multilayer dielectric substrate" was invented by Norikazu Fujii (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes after application of a bonding material, such as a metal paste, on a second dielectric substrate, a first dielectric substrate with a recess formed therein is laminated on the second dielectric substrate. Thereafter, the bonding material is sintered to form a cavity inside the dielectric substrate."

The patent was filed on Feb. 13, 2023, under Applica...