US Patent Issued to MURATA MANUFACTURING on Sept. 1 for "Vibration structure, panel module, and housing module" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,726,097, issued on Sept. 1, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).

"Vibration structure, panel module, and housing module" was invented by Shozo Otera (Nagaokakyo, Japan), Jun Endo (Nagaokakyo, Japan) and Yutaka Ishiura (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A vibration structure that includes: a housing; a panel having a main surface; an inner frame physically connected to the panel and the housing, the inner frame including a first portion overlapping the housing as viewed in a normal direction of the main surface; an outer frame physically connected to the panel and the housing, the outer frame s...