US Patent Issued to MURATA MANUFACTURING on Oct. 27 for "High frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,980, issued on Oct. 27, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).

"High frequency module and communication device" was invented by Atsushi Ono (Nagaokakyo, Japan), Yoshiaki Sukemori (Nagaokakyo, Japan), Yoshiki Kogushi (Nagaokakyo, Japan) and Hisanori Namie (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high frequency module capable of improving a heat dissipation performance of a power amplifier includes a mounting board, a power amplifier, and a connection member. The mounting board has a first main surface facing a second main surface. The power amplifier is disposed on the second main surface of the ...