US Patent Issued to MURATA MANUFACTURING on Oct. 20 for "Method for manufacturing acoustic wave element and acoustic wave element" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,771,310, issued on Oct. 20, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Method for manufacturing acoustic wave element and acoustic wave element" was invented by Shinya Jonosono (Nagaokakyo, Japan) and Takashi Yamane (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing an acoustic wave element includes preparing a wafer, attaching the wafer to a dicing tape, dicing the wafer to singulate the acoustic wave element, and abutting a pin against the acoustic wave element with the dicing tape interposed therebetween to separate the acoustic wave element from the dicing tape, and pick up the acoustic w...