US Patent Issued to Murata Manufacturing on Nov. 3 for "High frequency module and communication apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,155, issued on Nov. 3, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan).

"High frequency module and communication apparatus" was invented by Hisanori Murase (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high frequency module includes a mounting substrate and an IC chip. The IC chip includes a plurality of switches and a plurality of low noise amplifiers. The mounting substrate includes a first ground layer, a second ground layer, a first via conductor group, and a second via conductor group. The first ground layer has a plurality of slits. The plurality of slits include a first slit and a second slit. The first slit is ar...