ALEXANDRIA, Va., May 5 -- United States Patent no. 12,620,712, issued on May 5, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).
"Multilayer board and antenna module" was invented by Kentarou Kawabe (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer board includes a multilayer body including a first radiation conductor layer, a ground conductor layer, a first wiring layer, and a second wiring layer. The first wiring layer is electrically connected to a first radiation conductor layer at a first power supply point positioned closest to a first straight line in a first outer edge and intersects but is not orthogonal to the first straight line in a view along a Z-ax...