US Patent Issued to Murata Manufacturing on May 26 for "Electronic component mounting structure and method for manufacturing same" (Japanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,733, issued on May 26, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan).

"Electronic component mounting structure and method for manufacturing same" was invented by Takashi Kitahara (Nagaokakyo, Japan), Kensuke Otake (Nagaokakyo, Japan) and Kyo Shin (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed to an electronic component mounting structure including: a circuit board provided on a surface thereof with a first electrode containing Cu as a main component; and an electronic component mounted on the circuit board, the electronic component including a second electrode on a surface thereof; ...