US Patent Issued to MURATA MANUFACTURING on May 19 for "High-frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,633,956, issued on May 19, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).

"High-frequency module and communication device" was invented by Masanari Miura (Nagaokakyo, Japan), Kiyoshi Aikawa (Nagaokakyo, Japan), Hiroyuki Nagamori (Nagaokakyo, Japan), Takanori Uejima (Nagaokakyo, Japan), Yuji Takematsu (Nagaokakyo, Japan), Takahiro Yamashita (Nagaokakyo, Japan), Ryo Wakabayashi (Nagaokakyo, Japan), Yoshihiro Yoshimura (Nagaokakyo, Japan) and Takashi Hirose (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-frequency module is capable of two-uplink of a transmission signal in Bandtransmission of Band C, and includes...