US Patent Issued to MURATA MANUFACTURING on March 3 for "Wiring board" (Japanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,584, issued on March 3, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Wiring board" was invented by Yoshiki Tobita (Nagaokakyo, Japan) and Issei Yamamoto (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "To provide wiring board capable of reducing influence of variation in size of conductive member on coil conductor. Wiring board according to present disclosure includes insulating layer, plurality of land electrodes formed on lower surface of insulating layer, solder ball formed on surface of at least one of plurality of land electrodes, and coil conductor provided inside insulating layer and having winding axis inte...