US Patent Issued to MURATA MANUFACTURING on March 24 for "Multilayer resin substrate and method of manufacturing multilayer resin substrate" (Japanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,586,707, issued on March 24, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Multilayer resin substrate and method of manufacturing multilayer resin substrate" was invented by Rintaro Sugi (Nagaokakyo, Japan) and Keisuke Araki (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer resin substrate includes a stacked body and a coil including coil conductor patterns. A first coil conductor pattern includes a first non-overlapping portion not overlapping with a second coil conductor pattern, when viewed in a Z-axis direction. A second coil conductor pattern includes a second non-overlapping portion not overlapping wi...