US Patent Issued to MURATA MANUFACTURING on June 30 for "Multilayer substrate, method for manufacturing multilayer substrate, and electronic device" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,671,160, issued on June 30, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Multilayer substrate, method for manufacturing multilayer substrate, and electronic device" was invented by Nobuo Ikemoto (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A first conductive layer is in contact with a first inter-layer connection conductor and a second inter-layer connection conductor. The first conductive layer has a same composition as the first and second inter-layer connection conductors. At least one first metal foil layer is in contact with a third main surface of the first conductive layer. The at least one first metal foil ...