US Patent Issued to MURATA MANUFACTURING on July 28 for "High frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,379, issued on July 28, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).

"High frequency module and communication device" was invented by Keisuke Arima (Nagaokakyo, Japan), Hiroyuki Kani (Nagaokakyo, Japan) and Tomoaki Sato (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high frequency module includes a mounting board, a power amplifier, an electronic component, and a resin layer. The power amplifier is disposed on a main surface of either the first main surface or the second main surface of the mounting board. The electronic component is disposed on the main surface of the mounting board on which the power ampl...