US Patent Issued to Murata Manufacturing on July 14 for "High-frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,683,646, issued on July 14, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan).

"High-frequency module and communication device" was invented by Hiromichi Kitajima (Kyoto, Japan), Dai Nakagawa (Kyoto, Japan) and Takanori Uejima (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-frequency module includes a mounting board, a first electronic component, a first resin layer, and a first ground electrode. The mounting board has a first principal surface and a second principal surface opposite to each other. The first electronic component is disposed on the first principal surface of the mounting board. The first resin layer is disp...