US Patent Issued to Murata Manufacturing on July 14 for "Electronic component module" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,749, issued on July 14, was assigned to Murata Manufacturing Co. Ltd. (Kyoto-fu, Japan).

"Electronic component module" was invented by Akio Katsube (Nagaokakyo, Japan) and Hideki Shinkai (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes a substrate, a first component, a sealing resin, and a shield film. The substrate is provided with a first surface. The first component is mounted on the first surface. The first component is sealed with the sealing resin at least from a lateral side. The first component is provided with an exposed surface. The exposed surface is exposed through the sealing resin on a side opposite t...