US Patent Issued to MURATA MANUFACTURING on Feb. 24 for "Radio-frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,698, issued on Feb. 24, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Radio-frequency module and communication device" was invented by Dai Nakagawa (Kyoto, Japan), Takanori Uejima (Kyoto, Japan), Yuji Takematsu (Kyoto, Japan) and Isao Takenaka (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Improvement in heat dissipation capability is intended. A radio-frequency module includes a mounting substrate, a plurality of transmission filters, a resin layer, and a shield layer. The mounting substrate has a first major surface and a second major surface opposite to each other. The plurality of transmission filters is mounted on...