US Patent Issued to MURATA MANUFACTURING on Feb. 17 for "Radio frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,556,213, issued on Feb. 17, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Radio frequency module and communication device" was invented by Yuji Takematsu (Kyoto, Japan), Takanori Uejima (Kyoto, Japan) and Dai Nakagawa (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A radio frequency module includes a module substrate having a principal surface, one or more circuit components disposed on a principal surface side, a resin member disposed on the principal surface side and covering a side surface of the one or more circuit components, a metal shield layer in contact with a top surface of the resin member and a top surface of th...