US Patent Issued to Murata Manufacturing on Aug. 11 for "Substrate structure, module, method for manufacturing the substrate structure, and method for manufacturing the module" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,055, issued on Aug. 11, was assigned to Murata Manufacturing Co. Ltd. (Kyoto-fu, Japan).

"Substrate structure, module, method for manufacturing the substrate structure, and method for manufacturing the module" was invented by Tsuyoshi Takakura (Nagaokakyo, Japan), Ryoichi Kita (Nagaokakyo, Japan), Hideo Nakagoshi (Nagaokakyo, Japan), Hiroki Yoshimori (Nagaokakyo, Japan), Tadashi Nomura (Nagaokakyo, Japan) and Yoshihito Otsubo (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate structure comprises a substrate having a first surface, a first electrode disposed on the first surface, a bump connected to the first electrode, and...