ALEXANDRIA, Va., April 7 -- United States Patent no. 12,597,956, issued on April 7, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan).

"Radio frequency module and communication device" was invented by Takuma Kuroyanagi (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In the radio frequency module, a first electronic component and a second electronic component are mounted on a principal surface of a mounting board. A resin layer covers an outer perimeter surface of the first electronic component and an outer perimeter surface of the second electronic component. A conductive layer covers the resin layer and overlaps the first electronic component and the second electronic component in a ...