US Patent Issued to Murata Manufacturing on April 7 for "High frequency module and communication apparatus" (Japanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,597,955, issued on April 7, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan).

"High frequency module and communication apparatus" was invented by Yoichi Sawada (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high frequency module includes a module substrate that includes main surfaces facing each other, a power amplifier that is disposed on the main surface and capable of amplifying a transmission signal, an external connection terminal that is disposed on the main surface and set to a ground potential, and a via conductor that is formed inside the module substrate and connects the main surfaces. One end of the via conductor i...