ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,231, issued on April 14, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan).
"Electronic component and method for manufacturing the same" was invented by Hirofumi Oie (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "To provide electronic component in which bonding strength between external electrode and plating layer and bonding strength between external electrode and internal conductor can be increased. Electronic component according to present disclosure includes element body, interlayer connection conductor provided inside element body so as to extend to main surface of element body, external electrode formed on main s...