ALEXANDRIA, Va., June 2 -- United States Patent no. 12,642,694, issued on June 2, was assigned to MPACPLUS Co. LTD. (Seoul, South Korea).
"Head cooling device" was invented by Kwang Oh Son (Seoul, South Korea) and Sang Yeol Son (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A head cooling device includes a central portion that has a predetermined volume of space and is seated on a top portion of the user's head; and a plurality of wing portions radially connected to the central portion and extending in a fan shape, wherein each of the wing portions includes a plurality of chambers each having a predetermined volume of space in which a phase change material is charged, and a plurality of b...