ALEXANDRIA, Va., Feb. 24 -- United States Patent no. RE50,807, issued on Feb. 24, was assigned to Motion Engine Inc. (Montreal).
"3D mems device with hermetic cavity" was invented by Robert Mark Boysel (Honeoye Falls, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A three dimensional (3D) micro-electro-mechanical system (MEMS) device is provided. The device comprises a central MEMS wafer, and top and bottom cap wafers. The MEMS wafer includes a MEMS structure, such as an inertial sensor. The 5 top cap wafer, the bottom cap wafer and the MEMS wafers are stacked along a stacking axis and together form at least one hermetic cavity enclosing the MEMS structure. At least one of the top cap wafer and the bott...