US Patent Issued to MOSAIC MICROSYSTEMS on Nov. 3 for "Facilitating formation of a via in a substrate" (New York Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,797, issued on Nov. 3, was assigned to MOSAIC MICROSYSTEMS LLC (Rochester, N.Y.).

"Facilitating formation of a via in a substrate" was invented by David Howard Levy (Rochester, N.Y.) and Shelby Forrester Nelson (Pittsford, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of facilitating formation of a via in an inorganic substrate may include applying a single-sided acidic wet etching process to a first surface of the inorganic substrate in a first state in which the inorganic substrate has a mask layer set covering a second surface of the inorganic substrate; and applying a double-sided acidic wet etching process to the first surface and...