ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,211, issued on Aug. 25, was assigned to MITSUI KINZOKU COMPANY Ltd. (Tokyo).
"Method for producing wiring board" was invented by Yukiko Kitabatake (Ageo, Japan), Takenori Yanai (Ageo, Japan) and Yoshinori Matsuura (Ageo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a method for manufacturing a wiring substrate in which damage to a device layer during carrier release can be suppressed, and a photolithography process can be carried out with good accuracy on the device layer after carrier release. This method includes: providing a laminated sheet including a carrier, a release layer, a metal layer, and a device layer in order;...