US Patent Issued to Mitsui High-tec on Nov. 3 for "Metal component including conductive substrate with nickel layer and noble metal layer" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,801, issued on Nov. 3, was assigned to Mitsui High-tec Inc. (Fukuoka, Japan).

"Metal component including conductive substrate with nickel layer and noble metal layer" was invented by Kento Koga (Fukuoka, Japan), Shintaro Sugyo (Fukuoka, Japan) and Tomokatsu Kunitake (Fukuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a metal component used for manufacturing a semiconductor device, the metal component including: a substrate having a conductivity; a nickel layer formed on a portion of a surface of the substrate and containing nickel as a main component; and a noble metal layer formed on a surface of the nickel layer."

The patent...