US Patent Issued to MITSUI CHEMICALS ICT MATERIA on Feb. 17 for "Back grinding adhesive film and method for manufacturing electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,597, issued on Feb. 17, was assigned to MITSUI CHEMICALS ICT MATERIA INC. (Tokyo).

"Back grinding adhesive film and method for manufacturing electronic device" was invented by Hiroto Yasui (Sodegaura, Japan), Hiroyoshi Kurihara (Nagoya, Japan) and Jin Kinoshita (Nagoya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film including a base material layer, and an adhesive resin layer which is formed on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material, in which, when a viscoelastic characteris...