US Patent Issued to Mitsubishi Materials on May 19 for "Copper alloy, copper alloy plastic working material, component for electronic/electrical devices, terminal, bus bar, lead frame and heat dissipation substrate" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,630,905, issued on May 19, was assigned to Mitsubishi Materials Corp. (Tokyo).

"Copper alloy, copper alloy plastic working material, component for electronic/electrical devices, terminal, bus bar, lead frame and heat dissipation substrate" was invented by Hirotaka Matsunaga (Kitamoto, Japan), Kosei Fukuoka (Kitamoto, Japan), Kazunari Maki (Kitamoto, Japan), Kenji Morikawa (Aizuwakamatsu, Japan), Shinichi Funaki (Aizuwakamatsu, Japan) and Hiroyuki Mori (Sakai, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This copper alloy of one aspect contains greater than 10 mass ppm and less than 100 mass ppm of Mg, with a balance being Cu and inevitable impuri...