US Patent Issued to Mitsubishi Materials on June 23 for "Bonding sheet with preform layer, method for manufacturing bonded body, and to-be-bonded member with preform layer" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,661,867, issued on June 23, was assigned to Mitsubishi Materials Corp. (Tokyo).

"Bonding sheet with preform layer, method for manufacturing bonded body, and to-be-bonded member with preform layer" was invented by Daiki Furuyama (Sanda, Japan), Takuma Katase (Sanda, Japan), Kohei Otogawa (Sanda, Japan) and Junta Inoue (Sanda, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This bonding sheet (10, 20) with a preform layer (13) is a bonding sheet (10, 20) for bonding a substrate (16) and an electronic component (17), the bonding sheet (10, 20) includes a copper sheet (11) and a porous preform layer (13) including copper particles (12) provided on one ...