US Patent Issued to Mitsubishi Electric on Sept. 8 for "Semiconductor module" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,732,169, issued on Sept. 8, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor module" was invented by Nobuo Hashimoto (Fukuoka, Japan) and Wataru Hayashi (Fukuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module according to the present disclosure comprises a high potential side drive circuit and a low potential side drive circuit. The high potential side drive circuit includes: first reception terminals to receive a first data signal, an enable signal, and a first clock signal; a first shift register; and a first output terminal to output the first clock signal to the low potential side drive circuit as a sec...