ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,514, issued on Sept. 8, was assigned to Mitsubishi Electric Corp. (Tokyo).
"Semiconductor device and method of manufacturing semiconductor device" was invented by Keitaro Ichikawa (Tokyo), Yuji Shikasho (Tokyo) and Takuya Sakamoto (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a sealing resin being an insulating resin sealing the semiconductor element therein, and a plurality of electrode terminals each including a root portion being a root protruding from the sealing resin, a tip portion being a tip and portion extending from the root portion, and a middle portion provided between the tip portion and the root ...