US Patent Issued to MITSUBISHI ELECTRIC on Sept. 22 for "Semiconductor device and power converter" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,654, issued on Sept. 22, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo).

"Semiconductor device and power converter" was invented by Hodaka Rokubuichi (Tokyo), Yasuyuki Sanda (Tokyo) and Kei Yamamoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a lead frame having a mount surface, a semiconductor element disposed on the mount surface, a circuit board disposed apart from the mount surface in a thickness direction of the semiconductor device and electrically connected to the lead frame, a sealing resin that seals the lead frame, the semiconductor element, and the circuit board, and a connector. The lead fram...