US Patent Issued to Mitsubishi Electric on Oct. 27 for "Semiconductor manufacturing apparatus and method for manufacturing a semiconductor manufacturing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,877, issued on Oct. 27, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor manufacturing apparatus and method for manufacturing a semiconductor manufacturing apparatus" was invented by Masayuki Nishiyama (Tokyo), Naoki Yoshimatsu (Tokyo) and Rei Yoneyama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor manufacturing apparatus of the present disclosure includes a semiconductor module having a semiconductor device, a sealing material adapted to seal the semiconductor module, and a second terminal to be arranged outside the sealing material. The semiconductor module includes a first terminal electrically connected to...