US Patent Issued to Mitsubishi Electric on Nov. 3 for "Method for manufacturing semiconductor device, semiconductor device, electric power conversion device, and mobile body" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,895, issued on Nov. 3, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Method for manufacturing semiconductor device, semiconductor device, electric power conversion device, and mobile body" was invented by Yukimasa Hayashida (Fukuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor chip (6) is bonded to a metal pattern (5) of an insulating substrate (2). A recess (12) and a groove (13) are formed on an upper surface of an electrode (7). The groove (13) reaches a side surface of the electrode (7) from the recess (12). First solder (15) is placed in the recess (12). Second solder (17) is provided between an upper surface of th...