US Patent Issued to Mitsubishi Electric on May 5 for "Test apparatus for semiconductor device and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,618,897, issued on May 5, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Test apparatus for semiconductor device and method of manufacturing semiconductor device" was invented by Takuya Yoshimura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a test apparatus for a semiconductor device which enhances the reliability of a test on electrical characteristics. The test apparatus includes a stage, a probe holder, probes, a wind protection wall, and a gas supply part. The stage is capable of holding a semiconductor wafer in which the semiconductor device is formed. The probe holder is disposed above the stage. The probes each include a t...