US Patent Issued to MITSUBISHI ELECTRIC on May 26 for "Wire spark machining apparatus and method for producing semiconductor wafer" (Japanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,636,722, issued on May 26, was assigned to MITSUBISHI ELECTRIC Corp. (Tokyo).

"Wire spark machining apparatus and method for producing semiconductor wafer" was invented by Hidetaka Miyake (Tokyo) and Atsushi Itokazu (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus includes one wire electrode wound multiple times around a plurality of guide rollers to form a parallel wire part in which a plurality of wire cutting parts are arranged in parallel, a discharge waveform control device that controls an interpolar voltage waveform based on a discharge waveform command, and a wire running control device that controls running of the wire electrod...