US Patent Issued to Mitsubishi Electric on March 31 for "Semiconductor testing apparatus and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,999, issued on March 31, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor testing apparatus and method of manufacturing semiconductor device" was invented by Noritsugu Nomura (Tokyo) and Takuya Yoshimura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Occurrence of partial discharge is reduce and the test of electrical properties of a semiconductor device is and stably performed. A semiconductor testing apparatus includes a stage, a probe, a separation section, and a gas supply section. The probe performs electrical input and output to and from the semiconductor device held on the stage. The separation section separates the s...