US Patent Issued to Mitsubishi Electric on June 23 for "Semiconductor device with pairs of signal pads concentrated on control ic side" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,667,015, issued on June 23, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device with pairs of signal pads concentrated on control ic side" was invented by Keisuke Kawamoto (Tokyo) and Keisuke Eguchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to provide a technique capable of improving productivity of a semiconductor device by reducing a wiring length of a wire. A semiconductor device includes a semiconductor element and a control IC controlling the semiconductor element, wherein the semiconductor element includes a pair of signal pad groups made up of a plurality of signal pads, the control IC includes a plur...