US Patent Issued to Mitsubishi Electric on June 23 for "Semiconductor device and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,999, issued on June 23, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device and method of manufacturing semiconductor device" was invented by Takayuki Matsumoto (Fukuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a heat radiation plate; an insulating substrate disposed on an upper surface of the heat radiation plate; a semiconductor element mounted to an upper surface of the insulating substrate; a frame-like resin case disposed in a peripheral edge portion of the upper surface of the heat radiation plate and extending in an up-down direction to surround a lateral surface of each of th...